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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9196799 B1

PDFFull Text
Date of Patent:
Nov. 24, 2015

Filed:

Aug. 22, 2008

Led chips having fluorescent substrates with microholes and methods for fabricating

Applicants:

Ashay Chitnis, Santa Barbara, CA (US);

Bernd Keller, Santa Barbara, CA (US);

Inventors:

Ashay Chitnis, Santa Barbara, CA (US);

Bernd Keller, Santa Barbara, CA (US);

Assignee:

Cree, Inc., Goleta, CA (US);

Attorney:

Koppel, Patrick, Heybl & Philpott

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Valerie N Newton

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01); H01L 23/31 (2006.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 33/505 (2013.01); H01L 33/508 (2013.01); H01L 33/62 (2013.01); H01L 23/3114 (2013.01); H01L 33/38 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Methods for fabricating semiconductor devices such as LED chips at the wafer level, and LED chips and LED chip wafers fabricated using the methods. An LED chip wafer according to the present invention comprises a plurality of LEDs on a wafer and a plurality of pedestals, each of which is on one of the LEDs. A fluorescent substrate or preform ('preform') is provided covering at least some of the LEDs, the preform comprising holes with the pedestals arranged within the holes. During operation of the covered ones of said LEDs at least some light from the LEDs passes through the preform and is converted. LED chips are provided that are singulated from this LED chip wafer. One embodiment of a method for fabricating LED chips from a wafer comprises depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on the growth wafer. Pedestals are formed on the LEDs and a fluorescent preform is formed with holes. The fluorescent preform is bonded over at least some of the plurality of LEDs so that at least some light from the covered ones of said LEDs passes through the preform and is converted. The pedestals are arranged in the holes so that an electrical signal is applied to the LEDs through the pedestals.

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