The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
May. 17, 2013
Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong, HK;
Yuxing Ren, Hong Kong, HK;
Ziyang Gao, Shenzhen, HK;
Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong Science Park, Shatin, New Territories, Hong Kong, CN;
Abstract
A system for bonding a die to a high power dielectric carrier such as a ceramic dielectric core with double-sided conductive layers is described. In the system, the upper conductive layer has a first area whose surface has a first wettability. A second area that at least partially surrounds the first area has a surface with a second wettability that is greater than the first wettability. During bonding, an adhesive material bonding a chip to the substrate spreads among the first area by a downward force placed on the chip. Due to the difference in wettability, the adhesive material then spreads among the second area by a wetting force generated by the greater second wettability of the second area surface causing the chip to be drawn down until reaching a predetermined position. The predetermined position can be determined by substrate protrusions or substrate cavities.