The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Apr. 17, 2013
Applicant:

Futurewei Technologies, Inc., Plano, TX (US);

Inventors:

Vadim Gektin, San Jose, CA (US);

Youlin Jin, Santa Clara, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/00 (2006.01); H05K 7/20 (2006.01); H01L 23/40 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H05K 1/0203 (2013.01); H05K 1/18 (2013.01); H05K 7/209 (2013.01); H05K 2201/10598 (2013.01); Y10T 29/49117 (2015.01);
Abstract

Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first side of the circuit component a, a back plate having an initial curvature and positioned at a second side of the circuit component opposite to the heat sink, and one or more screws through the back plate and the circuit component and partially through the heat sink. A method further includes placing and flattening a curved back plate on a second side of a circuit board opposite to the first side, and fastening the back plate, the circuit board, and the heat sink together by inserting a plurality of screws through the back plate, the circuit board, and a partial depth on a single side of the heat sink.


Find Patent Forward Citations

Loading…