The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Nov. 21, 2013
International Business Machines Corporation, Armonk, NY (US);
Shawn A. Adderly, Essex Junction, VT (US);
Jeffrey P. Gambino, Westford, VT (US);
William J. Murphy, Ferrisburgh, VT (US);
Jonathan D. Chapple-Sokol, Burlington, VT (US);
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Abstract
Embodiments of the present invention provide a method for achieving uniform capacitance between a semiconductor wafer and an electrostatic chuck. In certain embodiments, the method comprises the step of forming a layer on a first side of the semiconductor wafer, wherein the layer has a specified resistivity. The method further comprises placing the semiconductor wafer on the electrostatic chuck, wherein the layer contacts the electrostatic chuck. The method further comprises applying a radio frequency signal to the electrostatic chuck, and processing a second side of the semiconductor wafer.