The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
May. 22, 2009
Applicants:
Thomas Feichtinger, Graz, AT;
Guenter Engel, Leibnitz, AT;
Axel Pecina, St. Martin, AT;
Inventors:
Assignee:
EPCOS AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H01C 1/084 (2006.01); H01C 7/10 (2006.01); H01C 7/12 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01C 1/084 (2013.01); H01C 7/10 (2013.01); H01C 7/12 (2013.01); H05K 1/181 (2013.01); H01L 2224/48091 (2013.01); H05K 1/0203 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10674 (2013.01);
Abstract
An electric component assembly comprising a semiconductor component () and a carrier is specified, wherein the carrier contains a highly thermally conductive ceramic and is connected to a varistor body. Heat from the semiconductor component can be at least partially dissipated to the carrier () by means of the varistor body.