The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Jun. 21, 2011
Applicants:

Surendra Singh, Chandler, AZ (US);

Robert Hogan, Chandler, AZ (US);

Frederick William Vensel, Gold Canyon, AZ (US);

Inventors:

Surendra Singh, Chandler, AZ (US);

Robert Hogan, Chandler, AZ (US);

Frederick William Vensel, Gold Canyon, AZ (US);

Assignee:

HONEYWELL INTERNATIONAL INC., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 29/04 (2006.01); G01N 29/06 (2006.01); G01N 29/34 (2006.01); G01N 29/46 (2006.01);
U.S. Cl.
CPC ...
G01N 29/043 (2013.01); G01N 29/069 (2013.01); G01N 29/0654 (2013.01); G01N 29/348 (2013.01); G01N 29/46 (2013.01); G01N 2291/044 (2013.01);
Abstract

Thermal Acoustic Imaging (TAI) methods and systems are provided for detecting defects in an object. The TAI system may include a plurality of acoustic wave transceivers (AWTs), which are positioned around the object at different locations, and a broadband frequency signal generator, which is coupled to each of the AWTs. The system may further include an acoustic processor configured to utilize the AWTs to gather acoustic data pertaining to the object, process the acoustic data to generate spectral response data, and then process the spectral response data to determine an optimized setup. The optimized setup may include optimized excitation frequencies and optimized inspection positions for positioning a plurality of infrared imaging devices at different locations around the object. A plurality of infrared imaging devices may then be selectively positioned with respect to the object at the optimized inspection positions and utilized to further inspect the object for defects.


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