The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Jun. 26, 2009
Yuuichi Kuzuba, Kanagawa, JP;
Takashi Monoi, Kanagawa, JP;
Ritsuya Matsumoto, Kanagawa, JP;
Kouichi Ogawa, Kanagawa, JP;
Satoshi Kanazawa, Kanagawa, JP;
Takaaki Hattori, Kanagawa, JP;
Yuuichi Kuzuba, Kanagawa, JP;
Takashi Monoi, Kanagawa, JP;
Ritsuya Matsumoto, Kanagawa, JP;
Kouichi Ogawa, Kanagawa, JP;
Satoshi Kanazawa, Kanagawa, JP;
Takaaki Hattori, Kanagawa, JP;
JAPAN POLYETHYLENE CORPORATION, Tokyo, JP;
Abstract
A polyethylene based resin exhibiting excellent moldability and durability and having an excellent balance between impact resistance and stiffness; and a hollow plastic molded article using the foregoing resin, which exhibits excellent moldability, durability and barrier properties and has an excellent balance between impact resistance and stiffness, are provided. The polyethylene based resin satisfies the following requirements (1) to (4): (1) a high-load melt flow rate (HLMFR) is from 1 to 100 g/10 min; (2) a density is from 0.940 to 0.960 g/cm; (3) a strain hardening parameter λmax of elongational viscosity is from 1.05 to 1.50; and (4) a rupture time in a full notch tensile creep test and a density satisfy the following relational expression (A): log(rupture time)≧−355×(density)+337.6(A).