The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Jun. 29, 2011
Satoshi Arai, Yokohama, JP;
Takeshi Hyugano, Tokyo, JP;
Satoshi Arai, Yokohama, JP;
Takeshi Hyugano, Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Provided is a laser bonding method which is a highly reliable laser bonding method for a thermoplastic resin and a metal, wherein the adhesiveness at an interface between a thermoplastic resin and a metal is improved to prevent peeling due to heat stress at the time of bonding. Accordingly, the method includes a step of forming an oxide layer having a higher oxygen functional group content than a bulk thermoplastic resin by subjecting at least a thermoplastic resin on the side of a bonding interface to a surface modification treatment prior to bonding, and the thermoplastic resin and a metal are bonded to each other by applying pressure and irradiating a laser in a state where the surface energy of the metal on the bonding surface side is increased to be larger than that of the thermoplastic resin having the oxide layer formed thereon.