The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2015

Filed:

Jul. 21, 2014
Applicant:

Honeywell International Inc., Morristown, NJ (US);

Inventors:

Mark L. La Forest, Granger, IN (US);

Mark C. James, Plymouth, MN (US);

Roger L. Klinedinst, North Liberty, IN (US);

Neil Murdie, Granger, IN (US);

David M. Wright, Springfield, MA (US);

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 70/48 (2006.01); C04B 35/83 (2006.01); F16D 69/02 (2006.01); B29K 105/06 (2006.01); B29L 31/16 (2006.01); B29L 31/00 (2006.01); B29K 307/04 (2006.01);
U.S. Cl.
CPC ...
B29C 70/48 (2013.01); C04B 35/83 (2013.01); F16D 69/023 (2013.01); B29K 2105/06 (2013.01); B29K 2307/04 (2013.01); B29L 2031/16 (2013.01); B29L 2031/7482 (2013.01); C04B 2235/608 (2013.01); C04B 2235/77 (2013.01);
Abstract

A pitch densification apparatus may be used to form a carbon-carbon composite material. The apparatus may be used to compress a carbon fiber material, and, thereafter, pitch densify the carbon fiber material. The compression and pitch densification of the carbon fiber material may be carried out within the same mold cavity of the pitch densification apparatus. In one example, an apparatus may comprise a mold defining a mold cavity that is configured to receive a material to be densified. The mold cavity is configured to be adjusted from a first volume to a second volume less than the first volume to compress the material in the mold cavity. The example apparatus may further comprise a gas source configured to apply a gas pressure in the mold cavity to force pitch into the material in the mold cavity to densify the material, and a vacuum source configured to create a vacuum pressure in the mold cavity at least prior to the application of the gas pressure.


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