The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Oct. 27, 2010
Masaaki Onodera, Kanagawa, JP;
Takehiko Sumi, Kanagawa, JP;
Teruo Tamada, Kanagawa, JP;
Yu Igarashi, Kanagawa, JP;
Yoshinori Ohno, Kanagawa, JP;
Masaaki Onodera, Kanagawa, JP;
Takehiko Sumi, Kanagawa, JP;
Teruo Tamada, Kanagawa, JP;
Yu Igarashi, Kanagawa, JP;
Yoshinori Ohno, Kanagawa, JP;
KYORAKU CO., LTD., Kyoto, JP;
Abstract
The invention provides a molded foam molding method capable of obtaining a molded foam in which pinholes may not be formed with ease even when a blow ratio is high and which has a high expansion ratio. The invention also provides a molded foam which includes no pinholes, is reduced in weight, and is excellent in heat insulating property. The molding method includes blending a polypropylene-based resin having an equilibrium compliance from 2.0 to 6.0 (10×Pa) with a foaming agent and kneading the blend in an extruder. The extruded foamed resin is molded so as to be fit along a mold by a pressurized fluid. Moreover, the molded foam is formed by the method described above, and has an expansion ratio from 1.5 to 5.0 times and an impact strength of not less than 30 kg·cm.