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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9192418 B1

PDFFull Text
Date of Patent:
Nov. 24, 2015

Filed:

Aug. 21, 2007

Laser processing apparatus, osseointegration method, implant material, and implant-material fabrication method

Applicants:

Masaru Kanaoka, Tokyo, JP;

Taira Ogita, Tokyo, JP;

Tooru Murai, Tokyo, JP;

Shigeru Tadano, Hokkaido, JP;

Masahiro Todoh, Hokkaido, JP;

Inventors:

Masaru Kanaoka, Tokyo, JP;

Taira Ogita, Tokyo, JP;

Tooru Murai, Tokyo, JP;

Shigeru Tadano, Hokkaido, JP;

Masahiro Todoh, Hokkaido, JP;

Assignees:

NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY, Sapporo-shi, JP;

Mitsubishi Electric Corporation, Tokyo, JP;

Attorneys:

Sughrue Mion, PLLC

Richard C. Turner

Primary Examiner:

Lynsey Crandall

Assistant Examiner:

Sebastian X Lukjan

Int. Cl.
CPC ...
A61B 18/18 (2006.01); A61N 5/06 (2006.01); A61C 5/02 (2006.01); A61B 17/88 (2006.01); A61B 18/20 (2006.01); A61C 1/00 (2006.01); A61C 8/00 (2006.01); B23K 26/00 (2014.01); B23K 26/32 (2014.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); B29C 65/16 (2006.01); B29C 65/82 (2006.01); B29C 65/00 (2006.01); A61F 2/46 (2006.01); A61F 2/30 (2006.01); A61B 18/22 (2006.01); A61F 2/00 (2006.01); A61B 18/00 (2006.01); A61B 17/16 (2006.01); A61B 17/00 (2006.01);
U.S. Cl.
CPC ...
A61B 17/88 (2013.01); A61B 18/20 (2013.01); A61C 1/0046 (2013.01); A61C 8/0089 (2013.01); B23K 26/0009 (2013.01); B23K 26/0036 (2013.01); B23K 26/0045 (2013.01); B23K 26/0081 (2013.01); B23K 26/3206 (2013.01); B23K 26/3273 (2013.01); B23K 26/385 (2013.01); B23K 26/403 (2013.01); B29C 65/16 (2013.01); B29C 65/8253 (2013.01); B29C 66/7483 (2013.01); A61B 17/16 (2013.01); A61B 17/164 (2013.01); A61B 18/22 (2013.01); A61B 2017/00508 (2013.01); A61B 2018/00565 (2013.01); A61B 2018/00601 (2013.01); A61B 2018/00619 (2013.01); A61B 2018/00636 (2013.01); A61B 2018/00779 (2013.01); A61F 2/30 (2013.01); A61F 2/4601 (2013.01); A61F 2/4644 (2013.01); A61F 2002/0086 (2013.01); B29C 65/1616 (2013.01); B29C 65/1619 (2013.01); B29C 65/1648 (2013.01); B29C 65/1651 (2013.01);
Abstract

A method of integrating bone and implant material includes drilling a hole in either one of the bone and the implant material through to a junction of the bone and the implant material by applying a laser beam to either one of the bone and the implant material and integrating the bone and the implant material by applying a laser beam to the junction through the hole drilled at the drilling.

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