The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Feb. 12, 2013
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Sung Yeol Park, Suwon, KR;
Suk Jin Ham, Suwon, KR;
Jung Tae Park, Suwon, KR;
Seung Heon Han, Suwon, KR;
Jung Eun Noh, Suwon, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
Disclosed herein is a method of manufacturing a printed circuit board, including; forming an electronic component including an electrode that is formed on at least one side of a body; forming terminals on an upper portion of the electrode and an upper portion of the body; providing a substrate in which a cavity is formed; mounting the electronic component formed with the terminals in the cavity of the substrate; and forming a buildup layer on an upper portion of the substrate and an upper portion of the electronic component.