The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Jun. 20, 2014
Applicant:
Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;
Inventors:
Jin Jeong, Kyunggi province, KR;
Chris Chung, Seoul, KR;
Deog Soon Choi, Seoul, KR;
Young Ho Lee, Seoul, KR;
Yong-Ik Choi, Kyoung Ki-Do, KR;
Assignee:
Avago Technologies General IP (Singapore) Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 24/06 (2013.01); H01L 24/17 (2013.01); H01L 24/49 (2013.01); H05K 1/092 (2013.01); H05K 1/111 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01);
Abstract
A bonding pad for use in attaching a semiconductor chip to a printed circuit board, includes: a copper layer; an organic layer disposed over the copper layer in a pattern such that part of the copper layer is exposed; and a gold layer disposed over the organic layer and in contact with the exposed part of the copper layer.