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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9190794 B1

PDFFull Text
Date of Patent:
Nov. 17, 2015

Filed:

Dec. 21, 2012

Method of retaining a solder material to a solder terminal and the solder assembly formed thereby

Applicant:

Chief Land Electronic Co., Ltd., New Taipei, TW;

Inventors:

Chung-Nan Pao, New Taipei, TW;

Sun Wu Chou, Keelung, TW;

Assignee:

CHIEF LAND ELECTRONIC CO., LTD., New Taipei, TW;

Attorney:

Li & Cai Intellectual Property (USA) Office

Primary Examiner:

Chau N Nguyen

Assistant Examiner:

Roshn Varghese

Int. Cl.
CPC ...
H01R 4/00 (2006.01); H01R 4/18 (2006.01); H02G 3/06 (2006.01); H02G 15/08 (2006.01); H01R 4/02 (2006.01); H01R 4/62 (2006.01); H01R 4/28 (2006.01); H01R 4/10 (2006.01); H01R 11/22 (2006.01); H01R 13/11 (2006.01); B23K 35/14 (2006.01); B21D 39/00 (2006.01); B23K 1/20 (2006.01); B23K 31/00 (2006.01); B23K 31/02 (2006.01); H01R 43/02 (2006.01); H01R 12/57 (2011.01); H01R 43/16 (2006.01);
U.S. Cl.
CPC ...
H01R 43/02 (2013.01); H01R 12/57 (2013.01); H01R 43/16 (2013.01); H01R 43/0256 (2013.01); Y10T 29/49208 (2013.01);
Abstract

The instant disclosure relates to a method of retaining a solder material onto a solder terminal comprising: a solder terminal and a solder material. The solder terminal includes a first surface, a second surface and a side, and is formed with a retaining hole. The solder material includes a winding portion, and a connection portion which extends on the opposite side from the winding portion of the solder material. The winding portion is arranged to cover the solder terminal along the first surface, the side and then the second surface. In addition, the connection portion is engaged with the solder terminal through the retaining hole and is bent like a hook.

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