The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Mar. 23, 2012
Applicants:

Hirotaka Fujii, Kyoto-fu, JP;

Eiichi Kobayashi, Kyoyo-fu, JP;

Kaoru Sudo, Kyoto-fu, JP;

Toshiro Hiratsuka, Kyoto-fu, JP;

Inventors:

Hirotaka Fujii, Kyoto-fu, JP;

Eiichi Kobayashi, Kyoyo-fu, JP;

Kaoru Sudo, Kyoto-fu, JP;

Toshiro Hiratsuka, Kyoto-fu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 9/38 (2006.01); H01Q 9/04 (2006.01); H01Q 1/48 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0414 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01);
Abstract

A chip antenna is mounted on a mother substrate including a feed line. In a representative embodiment, the chip antenna includes a laminated body including plural insulating layers, a radiating conductor element, a parasitic conductor element, a coupling adjusting conductor plate, and a LGA. The radiating conductor element is connected to the feed line via a first flat electrode pad of the LGA. On the other hand, the coupling adjusting conductor plate is provided between the radiating conductor element and the parasitic conductor element, and both end sides of the coupling adjusting conductor plate are connected to second and third flat electrode pads of the LGA. Another representative embodiment does not include a coupling adjusting conductor plate in the laminated body and includes an LGA that may or may not include second and third flat electrode pads.


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