The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Sep. 29, 2011
Applicants:
Jayesh Nath, Santa Clara, CA (US);
Ying Shen, Chapel Hill, NC (US);
Edwin Nealis, Cary, NC (US);
Inventors:
Assignee:
Aviat U.S., Inc., Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 11/00 (2006.01); H01Q 13/00 (2006.01); H03H 3/007 (2006.01); H01P 1/207 (2006.01); G02B 6/125 (2006.01); G02B 6/138 (2006.01); H03H 3/00 (2006.01); H03H 7/46 (2006.01);
U.S. Cl.
CPC ...
H01P 11/003 (2013.01); G02B 6/125 (2013.01); G02B 6/138 (2013.01); H01P 1/207 (2013.01); H01P 11/001 (2013.01); H01P 11/002 (2013.01); H03H 3/00 (2013.01); H03H 3/007 (2013.01); H03H 7/468 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/49016 (2015.01); Y10T 29/49117 (2015.01);
Abstract
Various embodiments are directed toward low cost passive waveguide components. For example, various embodiments relate to passive waveguide components created busing a low cost fabrication technology. In some embodiments, a three-dimensional (3D) printing process is used to create a design mold and a non-conductive structure of the waveguide is formed using a plastic injection molding process. A conductive layer may be formed over the non-conductive structure such that the conductive layer creates an electrical feature of the passive waveguide component.