The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Mar. 15, 2013
Applicants:

Shixi Louis Liu, Worcester, MA (US);

Harianto Wong, Southborough, MA (US);

Paul David, Bow, NH (US);

John B. Sauber, Millbury, MA (US);

Shaun D. Milano, Dunbarton, NH (US);

Raguvir Kanda, North Attleboro, MA (US);

Bruce Hemenway, Milford, MA (US);

Inventors:

Shixi Louis Liu, Worcester, MA (US);

Harianto Wong, Southborough, MA (US);

Paul David, Bow, NH (US);

John B. Sauber, Millbury, MA (US);

Shaun D. Milano, Dunbarton, NH (US);

Raguvir Kanda, North Attleboro, MA (US);

Bruce Hemenway, Milford, MA (US);

Assignee:

Allegro Micosystems, LLC, Worcester, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 43/02 (2006.01); H01L 43/06 (2006.01); H01L 43/04 (2006.01); H01L 21/48 (2006.01); G01R 33/00 (2006.01); G01R 33/09 (2006.01); G01R 15/20 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 43/04 (2013.01); G01R 15/207 (2013.01); G01R 33/0052 (2013.01); G01R 33/09 (2013.01); H01L 21/4828 (2013.01); G01R 15/202 (2013.01); H01L 23/49548 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 43/065 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/15162 (2013.01);
Abstract

In one aspect, a method includes processing a metal substrate, performing a first etch on a first surface of the metal substrate to form, for an integrated circuit package, secondary leads and a curved component having two primary leads and performing a second etch, on a second surface of the substrate opposite the first surface, at locations on the secondary leads and locations on the curved component to provide a locking mechanism. Each primary lead located at a respective end of the curved component.


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