The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Jan. 31, 2011
Applicants:

Takashi Kondo, Osaka, JP;

Koji Akazawa, Osaka, JP;

Takashi Ozaki, Osaka, JP;

Inventors:

Takashi Kondo, Osaka, JP;

Koji Akazawa, Osaka, JP;

Takashi Ozaki, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/56 (2010.01); B29C 43/18 (2006.01); H05B 33/04 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); B29C 43/18 (2013.01); H01L 33/50 (2013.01); H01L 33/505 (2013.01); H05B 33/04 (2013.01); H01L 33/507 (2013.01); H01L 2224/48227 (2013.01); H01L 2933/005 (2013.01); Y10T 428/31663 (2015.04);
Abstract

The present invention relates to an optical-semiconductor device, which is prepared by: arranging a sheet for optical-semiconductor element encapsulation including an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on the encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that the encapsulating resin layer faces the optical-semiconductor element-mounting substrate; followed by compression-molding, in which the wavelength conversion layer is present on an upper part of a molded body in which the optical-semiconductor element is embedded therein, but is not present on a side surface of the molded body.


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