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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9190539 B1

PDFFull Text
Date of Patent:
Nov. 17, 2015

Filed:

Jan. 20, 2015

Vertical conductive connections in semiconductor substrates

Applicant:

Stmicroelectronics, S.r.l., Agrate Brianza, IT;

Inventor:

Crocifisso Marco Antonio Renna, Floridia, IT;

Assignee:

STMICROELECTRONICS S.R.L., Agrate Brianza (MB), IT;

Attorney:

Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.

Primary Examiner:

Hoai V Pham

Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 31/02 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02019 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/13 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/14 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An embodiment of a die comprising: a semiconductor body including a front side, a back side, and a lateral surface; an electronic device, formed in said semiconductor body and including an active area facing the front side; a vertical conductive connection, extending through the semiconductor body and defining a conductive path between the front side and the back side of the semiconductor body; and a conductive contact, defining a conductive path on the front side of the semiconductor body, between the active area and the vertical conductive connection, wherein the vertical conductive connection is formed on the lateral surface of the die, outside the active area.

Find Patent Forward Citations

Renna, Crocifisso Marco Antonio. (2015). Vertical conductive connections in semiconductor substrates (U.S. Patent No. 9190539). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9190539

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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