The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Apr. 21, 2011
Applicants:

Kisho Ashida, Tokyo, JP;

Hiroyuki Ota, Tokyo, JP;

Inventors:

Kisho Ashida, Tokyo, JP;

Hiroyuki Ota, Tokyo, JP;

Assignee:

HITACHI, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/04 (2006.01); H01L 29/84 (2006.01); G01B 7/16 (2006.01); G01L 1/18 (2006.01); G01L 1/26 (2006.01); G01L 19/14 (2006.01);
U.S. Cl.
CPC ...
H01L 29/84 (2013.01); G01B 7/16 (2013.01); G01L 1/18 (2013.01); G01L 1/26 (2013.01); G01L 19/147 (2013.01);
Abstract

In a mechanical quantity measuring device () having a sensor chip () which outputs a sense output (S) corresponding to a mechanical quantity acting on the object to be measured (), and a flexible wiring board () which supports the sensor chip () and has a wire () to lead out the sense output (S) to outside, and in which in measuring the mechanical quantity, the sensor chip () and the flexible wiring board () are attached to the object to be measured (), a cutout () is provided on the flexible wiring board () near the sensor chip () and on the side where the wire () is arranged for the sensor chip (). Thus, change in the sense output (S) with time can be restrained.


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