The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Oct. 07, 2014
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Geun-Ho Kim, Seoul, KR;

Yu Ho Won, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 29/866 (2006.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 27/15 (2013.01); H01L 29/866 (2013.01); H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/62 (2013.01); H01L 33/50 (2013.01); H01L 33/60 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A light emitting device package is disclosed, which includes a first via hole and a second via hole disposed lower than a light emitting part, the first via hole and the second via hole are disposed at an outer area of the light emitting part, a bottom metal includes a first bottom metal, a second bottom metal, and a third bottom metal between the first bottom metal and the second bottom metal, a first conductive metal electrically connected to the first bottom metal through the first via hole and a second conductive metal electrically connected to the second bottom metal through the second via hole. Further, the first bottom metal, the second bottom metal are apart from the third bottom metal at a bottom surface of the substrate, and the third bottom metal is not electrically connected to the second conductive type metal layer.


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