The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Sep. 11, 2012
Applicants:

Jun Kawanabe, Kodama-gun, JP;

Chiori Mochizuki, Sagamihara, JP;

Minoru Watanabe, Honjo, JP;

Masato Ofuji, Honjo, JP;

Keigo Yokoyama, Honjo, JP;

Kentaro Fujiyoshi, Kumagaya, JP;

Hiroshi Wayama, Honjo, JP;

Inventors:

Jun Kawanabe, Kodama-gun, JP;

Chiori Mochizuki, Sagamihara, JP;

Minoru Watanabe, Honjo, JP;

Masato Ofuji, Honjo, JP;

Keigo Yokoyama, Honjo, JP;

Kentaro Fujiyoshi, Kumagaya, JP;

Hiroshi Wayama, Honjo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 40/14 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14609 (2013.01); H01L 27/14665 (2013.01);
Abstract

A detection apparatus includes a transistor disposed on a substrate, a conversion element disposed above the transistor and connected to the transistor, a capacitor connected in parallel with conversion element to the transistor, the capacitor including, between the substrate and the conversion element, an ohmic contact part connected to the conversion element, a semiconductor part connected to the ohmic contact part, and an electrically conductive part disposed at a location opposite to the semiconductor part and the ohmic contact part via an insulating layer, and a potential supplying unit configured to selectively supply a first electric potential to the electrically conductive part to accumulate charge carriers in the semiconductor part and a second electric potential to the electrically conductive part to deplete the semiconductor part. The detection apparatus configured in the above-described manner is capable of controlling pixel capacitance thereby achieving a high signal-to-noise ratio.


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