The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Jun. 04, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventor:

Michael Schmidt, Soest, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/66 (2006.01); H05K 3/00 (2006.01); H01L 21/48 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/33 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 22/12 (2013.01); H01L 24/27 (2013.01); H01L 24/743 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); H05K 3/007 (2013.01); H05K 3/0097 (2013.01); H01L 21/4867 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83001 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83855 (2013.01); H01L 2924/0781 (2013.01); H01L 2924/07802 (2013.01); H05K 3/3431 (2013.01); H05K 2203/0139 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/085 (2013.01);
Abstract

A method for producing a semiconductor module includes providing an adhesion carrier and a plurality of circuit carriers. The adhesion carrier has an adhesive upper side and a lower side opposite the adhesive upper side. Each of the circuit carriers includes a ceramic carrier and an upper conductor layer applied to the ceramic carrier, and a circuit carrier lower side. By placing the circuit carriers onto the adhesive upper side, the circuit carrier lower side of the circuit carriers contacts and adheres to the adhesive upper side, so that a quasi-panel is formed, in which the circuit carriers are processed while preserving the quasi-panel and can then be removed from the adhesive upper side.


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