The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Dec. 26, 2012
Applicant:
SK Hynix Inc., Icheon, KR;
Inventor:
Jin Yong Seong, Seoul, KR;
Assignee:
SK HYNIX INC., Icheon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/52 (2006.01); H01L 23/60 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/60 (2013.01); H01L 24/06 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract
A multi-chip package includes a single lead and a plurality of inner package chips. Each of the plurality of inner package chips includes at least one pad circuit and an internal circuit. The pad circuit is selectively coupled to the lead and configured to provide a chip address signal corresponding to a connection state to the lead. The inner package chip receives the chip address signal to identify a corresponding inner package chip.