The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Jan. 17, 2014
Applicant:
Fujitsu Semiconductor Limited, Yokohama-shi, Kanagawa, JP;
Inventor:
Koichi Nakamura, Fuchu, JP;
Assignee:
SOCIONEXT INC., Yokohama, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/03 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/563 (2013.01); H01L 23/3107 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/03 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/29 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/94 (2013.01); H01L 25/18 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1147 (2013.10); H01L 2224/11901 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16147 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32221 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48108 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8113 (2013.01); H01L 2224/8191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/831 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/85447 (2013.01); H01L 2224/92 (2013.01); H01L 2224/92163 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/94 (2013.01);
Abstract
A semiconductor package includes a semiconductor chip, a protruding pillar electrode provided on the semiconductor chip, and resin covering the semiconductor chip and the pillar electrode. The resin has a concave part and exposes a front edge portion of the pillar electrode from the resin at the bottom face of the concave part. The front edge portion of the pillar electrode is exposed from the concave part of the resin, which makes it possible to suppress increase in the height of the pillar electrode and to form the pillar electrodes having fine patterns or a narrow pitch.