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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9190211 B1

PDFFull Text
Date of Patent:
Nov. 17, 2015

Filed:

Aug. 06, 2014

Composite laminated ceramic electronic component

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-Fu, JP;

Inventors:

Seiji Fujita, Nagaokakyo, JP;

Hiroshige Adachi, Nagaokakyo, JP;

Kazuhiro Kaneko, Nagaokakyo, JP;

Satoru Adachi, Nagaokakyo, JP;

Sadaaki Sakamoto, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Karl Group

Int. Cl.
CPC ...
H01G 4/10 (2006.01); H01G 4/12 (2006.01); C04B 35/20 (2006.01); C04B 35/443 (2006.01); C04B 35/462 (2006.01); H01G 4/30 (2006.01); H01G 4/40 (2006.01); B32B 18/00 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H01G 4/129 (2013.01); B32B 18/00 (2013.01); C04B 35/20 (2013.01); C04B 35/443 (2013.01); C04B 35/462 (2013.01); H01G 4/105 (2013.01); H01G 4/1209 (2013.01); H01G 4/30 (2013.01); H01G 4/40 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3222 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/3262 (2013.01); C04B 2235/3281 (2013.01); C04B 2235/3445 (2013.01); C04B 2235/3481 (2013.01); C04B 2235/36 (2013.01); C04B 2237/341 (2013.01); C04B 2237/343 (2013.01); C04B 2237/346 (2013.01); C04B 2237/62 (2013.01); H01G 4/12 (2013.01); H01G 4/1218 (2013.01); H01L 23/552 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A composite laminated ceramic electronic component that includes co-fired low dielectric-constant ceramic layers and high dielectric-constant ceramic layers. The low dielectric-constant ceramic layers and high dielectric-constant ceramic layers are each composed of a glass ceramic containing: a first ceramic composed of MgAlOand/or MgSiO; a second ceramic composed of BaO, REO(RE is a rare-earth element), and TiO; glass containing each of 44.0 to 69.0 weight % of RO (R is an alkaline-earth metal), 14.2 to 30.0 weight % of SiO, 10.0 to 20.0 weight % of BO, 0.5 to 4.0 weight % of AlO, 0.3 to 7.5 weight % of LiO, and 0.1 to 5.5 weight % of MgO; and MnO, and the content ratios of the glass, etc. are varied between the low dielectric-constant ceramic layers and the high dielectric-constant ceramic layers.

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