The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Jun. 27, 2014
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Stevan G. Hunter, Pocatello, ID (US);

Bryce A. Rasmussen, Pocatello, ID (US);

Troy L. Ruud, Pocatello, ID (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 21/44 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5068 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); G06F 17/5045 (2013.01); G06F 17/5072 (2013.01); G06F 17/5081 (2013.01); H01L 23/4951 (2013.01); H01L 23/49527 (2013.01); H01L 23/49534 (2013.01); H01L 23/522 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/351 (2013.01);
Abstract

A design rule checker that performs a maximum pattern density check in a first intermediary metallization layer that underlies a top metallization layer and a pad opening in an integrated circuit. The maximum pattern density check is performed at least under some circumstances if a modulus of the primary metallization material is less than a modulus of a surrounding dielectric material. The maximum pattern density check verifies that the pattern density within the underlying portion is below a maximum pattern density that depends on the thickness of the access pad. A maximum metal width check may also be performed in this portion.


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