The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Oct. 11, 2013
Applicant:

Sony Dadc Austria Ag, Anif, AT;

Inventors:

Michael Pingert, Salzburg, AT;

Dario Borovic, Hallein, AT;

Alfred Paris, Salzburg, AT;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05D 7/06 (2006.01); B01L 3/00 (2006.01); B29C 65/00 (2006.01); B29C 65/16 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
G05D 7/0694 (2013.01); B01L 3/502707 (2013.01); B29C 65/1638 (2013.01); B29C 65/1654 (2013.01); B29C 66/1122 (2013.01); B29C 66/24221 (2013.01); B29C 66/54 (2013.01); B29C 66/65 (2013.01); B29C 66/836 (2013.01); B29C 66/863 (2013.01); B01L 2300/0887 (2013.01); B29C 65/1616 (2013.01); B29L 2031/756 (2013.01); Y10T 137/0402 (2015.04); Y10T 137/8593 (2015.04);
Abstract

A microfluidic device comprising in sequence first, second and third layers of plastics materials. A microfluidic circuit including a laterally extending microfluidic channel is formed at the interface between the first and second layers by surface structure in one or both of the first and second layers. A via is formed in the third layer for supplying or removing fluid to or from the microfluidic circuit. A conduit is formed in the second layer to provide fluid communication between the microfluidic channel and the via. A weld is formed at the interface between the second and third layers in a continuous closed path around the via and forms a fluid-tight seal for fluid flow between the via and the microfluidic circuit.


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