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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9187635 B1

PDFFull Text
Date of Patent:
Nov. 17, 2015

Filed:

Mar. 14, 2013

Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same

Applicant:

Elite Electronic Material (Zhongshan) Co.,ltd, Guangdong Province, CN;

Inventors:

Chang-Yuan Li, Guangdong Province, CN;

Yi-Jen Chen, Taoyuan County, TW;

Hong-Xia Peng, Guangdong Province, CN;

Assignee:

ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD., Guangdong Province, CN;

Attorneys:

WPAT, P.C.

Anthony King

Kay Yang

Primary Examiner:

Coris Fung

Int. Cl.
CPC ...
B32B 27/38 (2006.01); C08L 79/04 (2006.01); H05K 1/03 (2006.01); C08L 63/00 (2006.01); C08L 35/00 (2006.01); C09D 163/00 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08L 35/00 (2013.01); C09D 163/00 (2013.01); H05K 1/0353 (2013.01); Y10T 428/24917 (2015.01); Y10T 428/31529 (2015.04);
Abstract

A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of styrene-maleic anhydride (SMA) copolymer; and (C) 5 to 50 parts by weight of bisphenol S. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a high glass transition temperature, high heat resistance, and attractive appearance, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Find Patent Forward Citations

Li, Chang-Yuan. (2015). Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same (U.S. Patent No. 9187635). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9187635

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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