IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9187580 B1

PDFFull Text
Date of Patent:
Nov. 17, 2015

Filed:

May. 11, 2009

Resin particle having many recesses on the surface thereof

Applicants:

Shigeki Hamamoto, Himeji, JP;

Hirotsugu Kawata, Himeji, JP;

Kiyoshi Yamaguchi, Himeji, JP;

Masayoshi Okubo, Kobe, JP;

Inventors:

Shigeki Hamamoto, Himeji, JP;

Hirotsugu Kawata, Himeji, JP;

Kiyoshi Yamaguchi, Himeji, JP;

Masayoshi Okubo, Kobe, JP;

Assignee:

SUMITOMO SEIKA CHEMICALS CO., LTD., Hyogo, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Patrick Niland

Int. Cl.
CPC ...
B32B 5/16 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 27/00 (2006.01); B32B 27/30 (2006.01); C08F 8/00 (2006.01); C08F 30/08 (2006.01); C08F 130/08 (2006.01); C08F 230/08 (2006.01); C08F 2/44 (2006.01); A61K 8/895 (2006.01); A61Q 19/00 (2006.01); C08F 20/18 (2006.01); C08F 220/28 (2006.01); G02B 5/02 (2006.01); C08F 271/02 (2006.01); C08F 212/08 (2006.01);
U.S. Cl.
CPC ...
C08F 2/44 (2013.01); A61K 8/895 (2013.01); A61Q 19/00 (2013.01); B32B 5/16 (2013.01); B32B 9/045 (2013.01); B32B 27/308 (2013.01); C08F 8/00 (2013.01); C08F 20/18 (2013.01); C08F 220/28 (2013.01); C08F 230/08 (2013.01); C08F 271/02 (2013.01); G02B 5/0242 (2013.01); G02B 5/0278 (2013.01); C08F 212/08 (2013.01); C08F 2800/20 (2013.01); C08F 2810/20 (2013.01); C08F 2810/50 (2013.01);
Abstract

The present invention provides a resin particle having many recesses on the surface thereof, which has solvent resistance and heat resistance. More specifically, the present invention provides a resin particle having many recesses on the surface thereof which is obtained by using a seed particle, wherein a seed particle component in the resin particle has a crosslinked structure. Since the resin particle having many recesses on the surface thereof of the present invention is excellent in solvent resistance and heat resistance in addition to light diffusing properties, the resin particle is appropriate for use, for example, in not only cosmetics containing silicone oil and the like in a preparation, a light diffusing film and a light diffusing sheet prepared by dispersing resin particles as a light diffusing agent in an organic solvent such as 2-butanone and the like in a production process, and a light diffusing plate prepared by kneading at a high shear force the resin particles as a light diffusing agent with polystyrene or polymethyl methacrylate and the like which melts at a high temperature of approximately 300° C. in a production process.

Find Patent Forward Citations

Loading…