The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Nov. 30, 2010
Shinji Tai, Okayama, JP;
Hiroshi Kawai, Okayama, JP;
Satoshi Yamakoshi, Okayama, JP;
Kouta Isoyama, Okayama, JP;
Masao Hikasa, Okayama, JP;
Kentaro Yoshida, Okayama, JP;
Shinji Tai, Okayama, JP;
Hiroshi Kawai, Okayama, JP;
Satoshi Yamakoshi, Okayama, JP;
Kouta Isoyama, Okayama, JP;
Masao Hikasa, Okayama, JP;
Kentaro Yoshida, Okayama, JP;
KURARAY CO., LTD., Kurashiki-shi, JP;
Abstract
Disclosed is a multilayered structure that includes no less than 8 resin-layers, the resin-layer including a layer A constituted with a resin composition containing a gas barrier resin, and a layer B constituted with a resin composition containing a thermoplastic resin, at least one of the resin compositions included in the layer A and the layer B that are adjacent with each other containing a metal salt, the content of the metal salt being no less than 1 ppm and no greater than 10,000 ppm in terms of metal element equivalent, and an interlayer adhesive force between the layer A and the layer B being no less than 450 g/15 mm. The layer A and the layer B may be alternately laminated. Moreover, the average thickness of single layer of at least one selected from the layer A and the layer B is preferably no less than 0.01 μm and no greater than 10 μm.