The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Jun. 06, 2012
Applicants:

Jerzy Guterman, Mountain View, CA (US);

Jonathan Haylock, Los Angeles, CA (US);

Boon W. Shiu, San Jose, CA (US);

Peter Jeziorek, Mountain View, CA (US);

Erdinc Irci, Cupertino, CA (US);

Jiang Zhu, Sunnyvale, CA (US);

Mattia Pascolini, Campbell, CA (US);

Inventors:

Jerzy Guterman, Mountain View, CA (US);

Jonathan Haylock, Los Angeles, CA (US);

Boon W. Shiu, San Jose, CA (US);

Peter Jeziorek, Mountain View, CA (US);

Erdinc Irci, Cupertino, CA (US);

Jiang Zhu, Sunnyvale, CA (US);

Mattia Pascolini, Campbell, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01P 11/00 (2006.01); B29C 45/00 (2006.01); B29C 33/76 (2006.01); H01Q 1/12 (2006.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 7/00 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01);
U.S. Cl.
CPC ...
B29C 45/0055 (2013.01); B29C 33/76 (2013.01); H01Q 1/12 (2013.01); H01Q 1/2266 (2013.01); H01Q 1/38 (2013.01); H01Q 7/00 (2013.01); B29C 45/14639 (2013.01); B29C 45/16 (2013.01); B29C 2045/0058 (2013.01);
Abstract

Electronic devices may be provided with antenna structures. The antenna structures may include an antenna support structure covered with patterned antenna traces. An antenna support structure may be mounted in an electronic device so that a surface of the antenna support structure that is covered with patterned antenna traces lies flush with a planar surface of the electronic device housing. A display cover layer or other planar structure may be attached to the surface of the antenna support structure and the planar surface of the housing adhesive. Injection molding and extrusion techniques may be used in forming a support structure with elongated parallel cavities. An injection molding tool may have a mold core supported by a support structure at one end, supporting engagement features at the ends of mating mold core structures, or support pins. Molded interconnect devices may be soldered to laser direct structuring components to form antennas.


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