The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Jan. 20, 2011
Applicants:
Isao Sunaga, Tokyo, JP;
Daigo Kawabata, Tokyo, JP;
Inventors:
Isao Sunaga, Tokyo, JP;
Daigo Kawabata, Tokyo, JP;
Assignee:
AKEBONO BRAKE INDUSTRY CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 15/00 (2006.01); B29C 43/36 (2006.01); B29C 33/20 (2006.01); B29C 43/50 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 43/36 (2013.01); B29C 33/20 (2013.01); B29C 2043/3615 (2013.01); B29C 2043/3628 (2013.01); B29C 2043/503 (2013.01); B29K 2105/251 (2013.01);
Abstract
In a method for molding a resin piston by charging a preheated resin tablet into a cavity of a molding die, and by carrying out compression molding while heating, at a time point when an internal pressure of the cavity arrives at a determined pressure, by pressurizing a pressurizing margin in the molding die, resin which overflows from the molding die is discharged from a passage which is defined in an area except an outer circumferential surface of the piston, while the internal pressure of the cavity is maintained. After a thermosetting cycle has finished, the molding dieis opened.