The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2015

Filed:

Oct. 29, 2014
Applicants:

Yongcai Wang, Rochester, NY (US);

John Andrew Lebens, Rush, NY (US);

Ronald Steven Cok, Rochester, NY (US);

Inventors:

Yongcai Wang, Rochester, NY (US);

John Andrew Lebens, Rush, NY (US);

Ronald Steven Cok, Rochester, NY (US);

Assignee:

EASTMAN KODAK COMPANY, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); B05D 3/00 (2006.01); H01J 37/32 (2006.01); B29C 59/00 (2006.01); B29K 101/12 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B05D 3/007 (2013.01); B29C 59/005 (2013.01); H01J 37/32009 (2013.01); B29K 2101/12 (2013.01); B29K 2105/0011 (2013.01); B29K 2995/0005 (2013.01);
Abstract

A method of making an imprinted multi-layer structure includes providing a support and locating a first curable layer including a first material on or over the support. A second curable layer including a second material different from the first material is located on or over the first curable layer. The first curable layer and the second curable layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second curable layer. The first curable layer and the second curable layer are cured in a single step to form a first cured layer and a second cured layer. The imprinting stamp is removed to form an imprinted multi-layer structure with a depth greater than the thickness of the second cured layer.


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