The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Jun. 11, 2012
Applicants:

Shridhara Shanbhogue, Bangalore, IN;

Shanoprasad Kunjappan, Bangalore, IN;

Ashutosh Kumar Pandey, Bangalore, IN;

Arulselvam Arumugam, Bangalore, IN;

Ramkrishna U. Pal, Bangalore, IN;

Dathathreya Durgadhahalli Ganesh, Bangalore, IN;

Inventors:

Shridhara Shanbhogue, Bangalore, IN;

ShanoPrasad Kunjappan, Bangalore, IN;

Ashutosh Kumar Pandey, Bangalore, IN;

ArulSelvam Arumugam, Bangalore, IN;

Ramkrishna U. Pal, Bangalore, IN;

Dathathreya Durgadhahalli Ganesh, Bangalore, IN;

Assignee:

Honeywell International, Inc., Morristown, NJ (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01); H05K 7/14 (2006.01); H05K 1/14 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/142 (2013.01); H05K 1/144 (2013.01); H05K 7/20409 (2013.01); H05K 5/0026 (2013.01); H05K 9/0083 (2013.01); H05K 2203/1355 (2013.01);
Abstract

In general, the disclosure is directed to sealed enclosures and devices that include enclosures for protecting enclosed heat sensitive components from the heat generated by enclosed heat producing components. Heat producing components within the enclosure may be placed to achieve uniform distribution of heat produced by the heat producing components, to optimize the dissipation of heat from the heat producing components to the enclosure, and to minimize the heat experienced by the heat sensitive components. The exterior of the enclosure may be designed to increase thermal dissipation and to protect against thermal radiation.


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