The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Oct. 26, 2007
Applicants:

Lucien D. Laude, Rabastens-de-Bigorre, FR;

Robert J. Greenberg, Los Angeles, CA (US);

Inventors:

Lucien D. Laude, Rabastens-de-Bigorre, FR;

Robert J. Greenberg, Los Angeles, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); B05D 3/06 (2006.01); B05D 5/12 (2006.01); H05K 3/18 (2006.01); C25D 5/02 (2006.01); C25D 5/56 (2006.01); C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 18/20 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/185 (2013.01); C23C 18/1612 (2013.01); C23C 18/1639 (2013.01); C23C 18/1641 (2013.01); C23C 18/1692 (2013.01); C23C 18/1868 (2013.01); C23C 18/204 (2013.01); C25D 5/02 (2013.01); C25D 5/56 (2013.01); H05K 1/032 (2013.01); H05K 1/0393 (2013.01); H05K 3/0035 (2013.01); H05K 3/28 (2013.01); H05K 3/421 (2013.01); H05K 3/4661 (2013.01); H05K 2201/0162 (2013.01);
Abstract

The invention is a method of making a flexible electrode array, comprising a silicone containing body, a metal trace layer and an electrode pad on the surface, including the steps of irradiating a surface area of a molded silicone containing layer yielding traces with the light beam from a pulsed ultraviolet laser source; immersing said irradiated molded silicone layer for inducing the deposit of metal ions to form metal traces; applying a silicone containing layer on the silicone containing layer and the metal traces; irradiating the surface for drilling holes in the molded silicone containing layer; and immersing the irradiated molded silicone layer for inducing the deposit of metal ions to form metal electrode pads.


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