The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Dec. 14, 2012
Peking University Founder Group Co., Ltd., Beijing, CN;
Zhuhai Founder Tech. Hi-density Electronic Co., Ltd., Zhuhai, Guangdong, CN;
Zhuhai Founder Pcb Development Co., Ltd., Zhuhai, Guangdong, CN;
Lanyuan Chen, Beijing, CN;
Haode Li, Beijing, CN;
Peking University Founder Group Co., Ltd., Beijing, CN;
Zhuhai Founder Tech. Hi-Density Electronic Co., Ltd., Zhuhai, Guangdong, CN;
Zhuhai Founder PCB Development Co., Ltd., Zhuhai, Guangdong, CN;
Abstract
The invention discloses a printed circuit board compensation processing method for fabricating a BGA despite a small distance between a line and a pad of the BGA. The method includes compensating a pad and/or a line under a predetermined condition, and removing a portion of the pad facing the line by a second predetermined width when the shortest distance between the compensated line and pad is smaller than a first predetermined distance. The invention further discloses a device for performing the method and a PCB fabricated using the method.