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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9185805 B1

PDFFull Text
Date of Patent:
Nov. 10, 2015

Filed:

Sep. 14, 2012

Method of manufacturing a circuit substrate

Applicant:

Yutaka Fukuda, Echizen, JP;

Inventor:

Yutaka Fukuda, Echizen, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Carl Arbes

Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/16 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 1/03 (2006.01); H05K 3/24 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 21/481 (2013.01); H01L 21/4853 (2013.01); H01L 23/13 (2013.01); H01L 23/16 (2013.01); H01L 23/49816 (2013.01); H01L 24/81 (2013.01); H05K 1/111 (2013.01); H05K 3/0014 (2013.01); H05K 3/4007 (2013.01); H05K 3/4697 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81136 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01056 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15153 (2013.01); H05K 1/0306 (2013.01); H05K 3/245 (2013.01); H05K 3/3436 (2013.01); H05K 3/4061 (2013.01); H05K 3/4611 (2013.01); H05K 3/4629 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/091 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/308 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49139 (2015.01); Y10T 29/49165 (2015.01); Y10T 156/10 (2015.01); Y10T 156/1052 (2015.01);
Abstract

A thin circuit substrate and a circuit module are arranged such that the circuit module includes an IC mounted on a circuit substrate, the IC includes an IC body and an solder bump located on a mounting surface of the IC body, and the circuit substrate includes a substrate including a recess formed by recessing a portion of a mounting surface of the substrate on which the IC is to be mounted, and a terminal protruding from the mounting surface of the substrate. The terminal is to be electrically connected to the solder bump.

Find Patent Forward Citations

Quick Actions:

Fukuda, Yutaka. (2015). Method of manufacturing a circuit substrate (U.S. Patent No. 9185805). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9185805

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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