The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Mar. 15, 2013
Applicant:

Elite Electronic Material (Zhongshan) Co.,ltd, Guangdong Province, CN;

Inventors:

Chang-Yuan Li, Guangdong Province, CN;

Li-Chih Yu, Tao-Yuan Hsien, TW;

Hong-Xia Peng, Guangdong Province, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0209 (2013.01); Y10T 428/31529 (2015.04);
Abstract

A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.


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