The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Aug. 21, 2014
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Ailan Zhu, Shenzhen, CN;

Mingxing Yang, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/00 (2006.01); H04M 1/02 (2006.01); C22C 47/00 (2006.01); B22D 17/14 (2006.01); B22D 25/06 (2006.01); B22D 17/00 (2006.01); B22D 21/02 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H04M 1/0202 (2013.01); B22D 17/007 (2013.01); B22D 17/14 (2013.01); B22D 21/022 (2013.01); B22D 25/06 (2013.01); C22C 47/00 (2013.01); H05K 5/0004 (2013.01); H04M 1/0266 (2013.01);
Abstract

The present invention provides a support assembly mounted between a rear cover and a screen of a handheld electronic device to support and fasten a component of the handheld electronic device. The support assembly includes an appearance part and an internal structure support part, where the appearance part and the internal structure support part are fabricated through integral molding of an amorphous alloy; the internal structure support part is formed by extending the top or the middle of the appearance part inwards; and an average thickness of the internal structure support part is less than 2 mm. The present invention simplifies a process of assembling the handheld electronic device. The present invention further provides a support assembly fabricating method and a handheld electronic device.


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