The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Apr. 07, 2011
Applicants:

Koichi Mukai, Ishikawa, JP;

Masahiko Ishimaru, Ishikawa, JP;

Takahiro Asada, Ishikawa, JP;

Chisato Komori, Ishikawa, JP;

Shoko Nagaki, Ishikawa, JP;

Inventors:

Koichi Mukai, Ishikawa, JP;

Masahiko Ishimaru, Ishikawa, JP;

Takahiro Asada, Ishikawa, JP;

Chisato Komori, Ishikawa, JP;

Shoko Nagaki, Ishikawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 10/48 (2006.01); H02J 7/00 (2006.01); H01H 85/046 (2006.01); H01M 10/42 (2006.01); H01H 85/46 (2006.01); H01H 85/02 (2006.01);
U.S. Cl.
CPC ...
H02J 7/0031 (2013.01); H01H 85/046 (2013.01); H01H 85/463 (2013.01); H01M 10/425 (2013.01); H01M 10/48 (2013.01); H01H 2085/0275 (2013.01); H01M 10/4264 (2013.01); H01M 2200/00 (2013.01); H01M 2200/10 (2013.01); H01M 2200/108 (2013.01);
Abstract

A protection element, connected onto an electric current path of an electric circuit, is provided with an insulating substrate, a heating resistor formed on one surface of the insulating substrate with a first insulating layer interposed therebetween, a low-melting-point metal body disposed above the heating resistor with a second insulating layer interposed therebetween and that constitutes part of the electric current path, and connection portions connected to both ends of the low-melting-point metal body and that electrically connect the electric current path and the low-melting-point metal body. The connection portions are formed on the surface of the insulating substrate with a first glass layer interposed therebetween.


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