The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Jun. 04, 2010
Bingzhou Chen, Shanghai, CN;
Guoping Zhang, Shanghai, CN;
Martijn Henri Richard Lankhorst, Eindhoven, NL;
Roger Henri Denker, Eindhoven, NL;
Jeroen Snelten, Liempde, NL;
Dennis Johannes Antonius Claessens, Eindhoven, NL;
Ludo Haenen, Sint Oedenrode, NL;
Jacobus Hubertus Anna Selen, Eindhoven, NL;
Patrick Van Kooten, Bexley, AU;
Bingzhou Chen, Shanghai, CN;
Guoping Zhang, Shanghai, CN;
Martijn Henri Richard Lankhorst, Eindhoven, NL;
Roger Henri Denker, Eindhoven, NL;
Jeroen Snelten, Liempde, NL;
Dennis Johannes Antonius Claessens, Eindhoven, NL;
Ludo Haenen, Sint Oedenrode, NL;
Jacobus Hubertus Anna Selen, Eindhoven, NL;
Patrick Van Kooten, Bexley, AU;
KONINKLIJKE PHILIPS N.V., Eindhoven, NL;
Abstract
A lighting device, such as a replacement lighting device, comprising a light source (LS), e.g. LEDs, for producing light along an optical axis (OA). A heat sink (HS) made of a material with an electrical resistivity being less than 0.01 Ωm, e.g. a metallic heat sink being a part of the housing, transports heat away from the light source (LS). A Radio Frequency (RF) communication circuit (CC) connected to an antenna (A) serves to enable RF signal communication, e.g. to control the device via a remote control. Metallic components, including the heat sink (HS), having an extension larger than 1/10 of a wavelength of the RF signal are arranged below a virtual plane (VP) drawn orthogonal to the optical axis (OA) and going through the antenna (A). Hereby a compact device can be obtained, and still a satisfying RF radiation pattern can be obtained. The antenna can be a wire antenna or a PCB antenna, e.g. a PIFA or a IFA type antenna. In a special embodiment the antenna is formed on a ring-shaped PCB with a central hole allowing passage of light from the light source. Preferably, the antenna is positioned at least 2 mm in front of the heat sink (HS).