The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Feb. 01, 2012
Kotaro Kimura, Osaka, JP;
Akihisa Hosoe, Osaka, JP;
Takayasu Sugihara, Osaka, JP;
Osamu Ohama, Osaka, JP;
Kazuki Okuno, Itami, JP;
Tomoyuki Awazu, Itami, JP;
Koji Nitta, Osaka, JP;
Kotaro Kimura, Osaka, JP;
Akihisa Hosoe, Osaka, JP;
Takayasu Sugihara, Osaka, JP;
Osamu Ohama, Osaka, JP;
Kazuki Okuno, Itami, JP;
Tomoyuki Awazu, Itami, JP;
Koji Nitta, Osaka, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;
Abstract
Provided is a method of producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, with which it is possible to form an aluminum structure having a low oxide content in the surface of aluminum (i.e., having an oxide film with a small thickness), and in particular, it is possible to obtain an aluminum porous body that has a large area. The method includes a step of preparing an aluminum-coated resin molded body in which an aluminum layer is formed, directly or with another layer therebetween, on a surface of a resin molded body composed of urethane, and a heat treatment step in which the aluminum-coated resin molded body is subjected to heat treatment at a temperature equal to or higher than 270° C. and lower than 660° C. to decompose the resin molded body.