The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

Aug. 14, 2013
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Tadamasa Miura, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 35/02 (2006.01); H01C 1/014 (2006.01); H01C 1/14 (2006.01); H01C 7/00 (2006.01); H01C 1/144 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 35/02 (2013.01); H01C 1/014 (2013.01); H01C 1/14 (2013.01); H01C 1/144 (2013.01); H01C 7/008 (2013.01); H01L 24/16 (2013.01); H01C 1/1406 (2013.01); H01C 1/1413 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/00013 (2013.01);
Abstract

An electronic-component mounting structure includes an electronic component which includes a metal substrate, a semiconductor ceramic layer located on the metal substrate, a pair of split electrodes located on the semiconductor ceramic layer, and plating films located on the split electrodes and the metal substrate, and a mounting body on which lands to be connected to the respective split electrodes of the electronic component are provided. The position of a peripheral end portion of each land to be connected to the corresponding split electrode is located farther inside than the position of a peripheral end portion of the split electrode. In addition, a plane area of the land is smaller than that of the split electrode.


Find Patent Forward Citations

Loading…