The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Aug. 05, 2014
Applicant:
Tsmc Solid State Lighting Ltd., Hsinchu, TW;
Inventors:
Shouli Steve Hsia, San Jose, CA (US);
Chih-Kuang Yu, Chiayi, TW;
Ken Wen-Chien Fu, Hsinchu, TW;
Hung-Yi Kuo, Taipei, TW;
Hung-Chao Kao, Taipei, TW;
Ming-Feng Wu, Toufen Township, TW;
Fu-Chih Yang, Fengshan, TW;
Assignee:
TSMC Solid State Lighting Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 27/15 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0008 (2013.01); H01L 27/15 (2013.01); H01L 33/005 (2013.01); H01L 33/62 (2013.01); H01L 33/0004 (2013.01);
Abstract
A light emitting diode (LED) structure comprises a first dopant region, a dielectric layer on top of the first dopant region, a bond pad layer on top of a first portion the dielectric layer, and an LED layer having a first LED region and a second LED region. The bond pad layer is electrically connected to the first dopant region. The first LED region is electrically connected to the bond pad layer.