The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2015

Filed:

May. 13, 2011
Applicants:

Yuki Seki, Itami, JP;

Issei Satoh, Itami, JP;

Koji Uematsu, Itami, JP;

Yoshiyuki Yamamoto, Itami, JP;

Inventors:

Yuki Seki, Itami, JP;

Issei Satoh, Itami, JP;

Koji Uematsu, Itami, JP;

Yoshiyuki Yamamoto, Itami, JP;

Assignee:

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/04 (2006.01); H01L 29/02 (2006.01); H01L 21/762 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 29/02 (2013.01); H01L 21/76254 (2013.01); H01L 27/1214 (2013.01); H01L 27/1266 (2013.01); B32B 2264/102 (2013.01); B32B 2307/704 (2013.01); B32B 2457/14 (2013.01); Y10T 428/24355 (2015.01);
Abstract

A composite base of the present invention includes a sintered base and a base surface flattening layer disposed on the sintered base, and the base surface flattening layer has a surface RMS roughness of not more than 1.0 nm. A composite substrate of the present invention includes the composite base and a semiconductor crystal layer disposed on a side of the composite base where the base surface flattening layer is located, and a difference between a thermal expansion coefficient of the sintered base and a thermal expansion coefficient of the semiconductor crystal layer is not more than 4.5×10K. Thereby, a composite substrate in which a semiconductor crystal layer is attached to a sintered base, and a composite base suitably used for that composite substrate are provided.


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