The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
May. 05, 2014
Applicant:
Omnivision Technologies, Inc., Santa Clara, CA (US);
Inventors:
Wei Zheng, Los Gatos, CA (US);
Dyson Hsin-Chih Tai, San Jose, CA (US);
Vincent Venezia, Los Gatos, CA (US);
Assignee:
OmniVision Technologies, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/146 (2006.01); H01L 21/762 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14687 (2013.01); H01L 21/76224 (2013.01); H01L 21/76829 (2013.01); H01L 27/1464 (2013.01); H01L 27/14645 (2013.01);
Abstract
A method for manufacturing a backside illuminated color image sensor includes (a) modifying the frontside of an image sensor wafer, having pixel arrays, to produce electrical connections to the pixel arrays, wherein the electrical connections extend depth-wise into the image sensor wafer from the frontside, and (b) modifying the backside of the image sensor wafer to expose the electrical connections.