The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Oct. 24, 2013
Applicant:
SK Hynix Inc., Icheon-si Gyeonggi-do, KR;
Inventors:
Ki Il Moon, Yongin-si, KR;
Jong Hyun Kim, Seoul, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/04 (2014.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 25/04 (2013.01); H01L 25/043 (2013.01); H01L 25/0657 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A semiconductor package includes: a plurality of lead members disposed with a space therebetween over a surface of a substrate, a first semiconductor chip disposed in a face-up manner over the first surface of the substrate between at least two of the plurality of lead members; a second semiconductor chip disposed in a face-up manner over the first semiconductor chip and the at least two lead members, and a connection member for connecting the substrate, the at least two lead members, the first semiconductor chip and the second semiconductor chip with one another.