The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Dec. 18, 2012
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Angelo Antonio Merassi, Caponago, IT;
Marco Ferrera, Concorezzo, IT;
Marco Mantovani, Lainate, IT;
Paolo Ferrari, Gallarate, IT;
Benedetto Vigna, Potenza, IT;
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
STMicroelectronics S.r.l., Agrate Brianza, IT;
Abstract
A semiconductor integrated device is provided with: a die having a body of semiconductor material with a front surface, and an active area arranged at the front surface; and a package having a support element carrying the die at a back surface of the body, and a coating material covering the die. The body includes a mechanical decoupling region, which mechanically decouples the active area from mechanical stresses induced by the package; the mechanical decoupling region is a trench arrangement within the body, which releases the active area from an external frame of the body, designed to absorb the mechanical stresses induced by the package.