The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Nov. 07, 2012
Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;
Takuto Yamaguchi, Tokyo, JP;
Osamu Ikeda, Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The purpose of the present invention is to increase the reliability of a semiconductor device in which a semiconductor element and a substrate are connected by solder and which is molded by resin. Solder containing easily volatized metals (Zn, Mg, Sb) is used for a solder material, and after a semiconductor elementis connected to a lead frameand wire bonding is carried out, vacuum heat treatment is applied, the easily volatized metals in the solder are volatized to adhere to a substrate surface, and an alloywith the lead frame is formed, thereby roughening the substrate surface and improving the adhesive strength of a sealing resinand the substrate.